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The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect
Figure 2 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
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US9082762B2 - Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip - Google Patents
Figure 2 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
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The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect
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