Electroless UBM Formation Service|Special Site of JX Metals
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Introduction to application examples, advantages, and standard specifications of electroless UBM formation service
総合めっき薬品会社|メルテックス株式会社
UBM (OPM: Over Pad Metal, FSM: Front Side Metal and Electroless plating) Service - JX Metals
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総合めっき薬品会社|メルテックス株式会社
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Compound Semiconductor Wafers - InP, CdZnTe -|Special Site of JX Metals
Special Site of JX Metals
UBM (under bump metallurgy) structure
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a) Under-bump metallization and micro-bumps fabricated on the VLSI
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