Thermal Design with Exposed-Pad Packages - Technical Articles

This technical brief discusses thermal design techniques for IC packages—such as QFN, DFN, and MLP—that incorporate an exposed thermal pad.

The RX13T 32-Bit MCU QFN Package Is Now Available,, 59% OFF

Thermal Design with Exposed-Pad Packages - Technical Articles

The RX13T 32-Bit MCU QFN Package Is Now Available,, 59% OFF

The RX13T 32-Bit MCU QFN Package Is Now Available,, 59% OFF

The RX13T 32-Bit MCU QFN Package Is Now Available,, 59% OFF

The RX13T 32-Bit MCU QFN Package Is Now Available,, 59% OFF

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The RX13T 32-Bit MCU QFN Package Is Now Available,, 59% OFF

Thermal Design with Exposed-Pad Packages - Technical Articles

The RX13T 32-Bit MCU QFN Package Is Now Available,, 59% OFF

Thermal Design with Exposed-Pad Packages - Technical Articles

Thermal Design with Exposed-Pad Packages - Technical Articles

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