Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds
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Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains
Advances in Epoxy Molding Compounds - Dexter Technical Paper (1992)
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Tunable negative thermal expansion in La(Fe, Si)13/resin
Hysol MG57F-0660, Gold Epoxy Mold Compound
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Mold temperature have major influence for injection molding
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