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Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds

$ 12.00

5 (794) In stock

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Advances in Epoxy Molding Compounds - Dexter Technical Paper (1992)

Glass Transition Temperature (Tg) of Epoxy Molding Compounds

High Thermal Conductivity - FasterCapital

Network Formation and Physical Properties of Epoxy Resins for

Thermally Conductive Epoxy Adhesives

Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips

Fillers in Action: How to Achieve High Particle Loadings - Polymer

High thermal conductivity of boron nitride filled epoxy composites prepared by tin solder nanoparticle decoration - ScienceDirect

Tunable negative thermal expansion in La(Fe, Si)13/resin

Hysol MG57F-0660, Gold Epoxy Mold Compound

What types of epoxy have a low coefficient fo thermal expansion? - Quora

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